What is Low Pressure Molding?
Low Pressure Molding (LPM) is different from traditional injection molding. As the name suggests, applied parts are molded at lower pressures, allowing precision for gentle encapsulation of delicate electronic assemblies to be molded and protected without damage.
Low Pressure Molding Process
The overmolding process involves loading bare, unshielded PCBs and cable assemblies into a precision-crafted die tooling tool, then filling the cavity with the appropriate low-pressure molding material. This effectively surrounds the component as desired and produces a sealed and protected product that can be handled and tested immediately.
Why Low Pressure Molding?
Conventional injection molding materials require processing temperatures and pressures that would damage a printed circuit board. Low Pressure Molding (LPM) uses thermoplastic materials with very low viscosity, allowing for overmolding and encapsulation of even the most sensitive circuit board assemblies. Because the materials are natural adhesives, the process is well-suited to sealing circuitry against dirt, dust and moisture
FOBOS; is an expert organization that has gained trust and appreciation both in Turkey and around the world with its advanced technology and nature-friendly mold design solutions and applications. It continues its production activities in the light of the principle of "CUSTOMER SATISFACTION FIRST" in its Istanbul facility of 2500 m2.
Fobos increases domestic production and exports and offers the advantages of domestic production to its stakeholders and customers, and to ensure that domestic production is accepted in the market. In this way, it provides added value for the country's economy.
We believe that using the right technology plays a key role for a successful solution, and we strive to offer customer satisfaction and production quality at international standards.
